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Power Supplies A to Z

We've included this handy glossary to help with the terminology & abbreviations relating to power products. Pick a letter below to begin, or download the glossary to refer to it whenever you like.

A From 'A' to 'AWG'
B From 'Back Electromotive Force (Back EMF)' to 'Bus Converter '
C From 'C' to 'Curve B (or Class B)'
D From 'dB' to 'Dynamic Load'
E From 'Earth' to 'External Fusing'
F From 'F' to 'Fusible Link'
G From 'Galvanic' to 'Grounded'
H From 'H' to 'Hz'
I From 'I ' to 'Isolation Voltage'
J From 'J ' to 'Junction Field Effect Transistor (JFET)'
K From 'K' to 'kWh'
L From 'L ' to 'LVD'
M From 'Magnetic Amplifier (Mag Amp)' to 'Multi-Resonant Topology (MRT)'
N From 'Nano ' to 'NTC'
O From 'OCV' to 'OVP'
P From 'P' to 'PWM '
Q From 'Quarter Brick ' to 'Quarter Brick '
R From 'R' to 'RS485'
S From 'S' to 'System International d’Unites (SI)'
T From 't' to 'TUV '
U From 'U' to 'USB'
V From 'V' to 'Vss'
W From 'W' to 'Working Voltage'
X-Z From 'X ' to 'Zetta '
# From '°C ' to '°F '

Term of the day : 'Printed Circuit Board (PCB)'

An insulating substrate with conductive (usually copper) tracks connecting components. The PCB is used to both support and interconnect components. PCBs are made of many materials including resin impregnated paper (often called FR-2), fibreglass (FR-4), various plastics (more commonly used for high power RF circuits), ceramic or metal (usually aluminium – see IMS). PCBs can have one or more layers of copper tracks and the different layers are connected with Vias. Additional layers make the PCB cost more but have benefits (such as improving the EMC performance, improving heat conduction and reducing size).

Download the glossary :

Feel free to download the latest version of our glossary as a PDF file.

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